In unmounted devices, it may also refer to the packages solder connection features themselves, e. Processing and reliability issues for eutectic ausn solder joints dr. A controlchart based method for solder joint crack detection. Weibull plots comparing sac305 bga solder joint reliability to sac305 lga solder joint reliability. Samples were tested using 40125c temperature cycling. Reliability study of leadfree snagcu solder joints vs. Solder joint reliability is defined as the ability of your products solder joints to function under given conditions and for a specified period of. The article concludes with a brief discussion of materials options available to improve the lifetime, and hence reliability, of.
The reliability of the solder joints was studied using different solder paste and component combinations, printed circuit board surface finishes and pad structures, as well as reflow times. Thermal cycling reliability of chip resistor lead free solder. Processing and reliability issues for eutectic ausn solder joints abstract eutectic ausn solder is increasingly used in high reliability andor high temperature applications where conventional snpb and pbfree solders exhibit insufficient strength, creep resistance, and other issues. Upon release of electronics products with leadfree pbfree solders starting in 2006 and driven by the eus rohs legislation, a few models have been in use by the electronics industry to predict. Mechanical shock loads, such as those experienced from dropping a cell phone for example, induce stresses at very high strain rates. The high temperatures associated with ir or convection reflow solder processes are. Reliability behavior of leadfree solder joints in electronic. Mechanical shock test guidelines for solder joint reliability foreword this publication has been drafted as part of a joint working group between the ipc 610d task group and the jedec jc14.
Test method considerations for smt solder joint reliability. The reliability of a solder joint is defined as the probability that the solder joint can perform the required function under specified operating conditions for a given time interval. Identification of solder joint failures the helpline received a call from a manufacturer who had experienced solder joint reliability issues with gold plated pins in a leadfree solder. The article concludes with a brief discussion of materials options available to im. A systems approach to solder joint fatigue in spacecraft electronic packaging r. A key production issue that is always at the forefront among electronics manufacturers is the achievement of consistently acceptable solder joint reliability. Effect of voids on the reliability of bgacsp solder joints. Design and material parameter effects on bga solderjoint reliability for automotive applications burton carpenter freescale semiconductor, inc. The most important component of system is material of solder joint, because its share in the system is about 75% and this is a big part. Effect of gold content on the reliability of snagcu solder joints. The solder joint is part of a heterogenous dynamic system and its necessary to examine all parts of this system, when there is the requirement for high reliability.
Mroczkowski connntext associates i had the pleasure of working with dr mort antler on several occasions over the years. Most frequently when i was a member of the steering and technical committees for the holm conference on electircal contacts. A systems approach to solder joint fatigue in spacecraft. Solder joint reliability of bga, csp, flip chip, and fine. An overview of the solder joint reliability assessment methodology for a custom design leadfree, high performance rf package has been presented, including. Design and material parameter effects on bga solder joint reliability for automotive applications burton carpenter freescale semiconductor, inc. Apr 19, 2012 with more consumer products moving towards environmentally friendly packaging, making solder pbfree has become an urgent task for electronics assemblies.
Solder attachment reliability, accelerated testing, and. Solder joint reliability assessment for a high performance rf. In this work, the thermal cycling reliability of several 2512 chip resistor lead free solder joint configurations has been investigated. Jet propulsion laboratory california institute of technology pasadena, ca 91109 differential expansion induced fatigue resulting from temperature cycling is a leading cause of solder joint failures in spacecraft. Thermal cycling test results showed that the af between 0 100c and 40125c thermal profiles is 3.
Reliability of solder joints assembled with leadfree solder vmasayuki ochiai vtoshiya akamatsu vhidefumi ueda manuscript received february 12, 2002 to protect the natural environment, we will introduce the use of leadfree solder instead of the current tinlead solder in the assembly of printed circuit boards in electronics equipment. In solder joint reliability studies, accelerated temperature cycling atc is the most used test and a weibull plot of failure rate vs. Failure analysis and design of a heavily loaded pin joint. With more consumer products moving towards environmentally friendly packaging, making solder pbfree has become an urgent task for electronics assemblies. Pga socket to pcb warpage and socket flatness as a future study is reported. An acceleration model for leadfree sac solder joint reliability under thermal cycling vasu vasudevan and xuejun fan intel corporation, 5200 elam young pkwy, hillsboro, or 97124.
Scanning electron microscope sem testing of samples was used in order to help establish the cause. Design and material parameter effects on bga solderjoint. Processing and reliability issues for eutectic ausn solder joints. Study on solder joint reliability of fine pitch csp. First, the current solder joint fatigue study approaches are introduced and the popular solder joint fatigue. Since there are no lead fingers in the immediate corners of the package for the dual row design, which is typically the highest stress area of the package during testing, the overall solder joint lifetime can be increased.
Addressing the issues around solder joint voids in surface. Design for reliability werner engelmaier engelmaier associates, l. The acceleration factors were determined in calculations for solder joint reliability summary report, which is located in the same mechanical test reports section as this report. In an initial study, a comparison was made between the solder joint reliabilities obtained with components fabricated with both tinlead and pure tin solder terminations. The purpose of this study is to determine the acceptable level of au in sac305 solder joints. Ormond beach, fl 32174 904 4378747 abstract the emerging new technologies provide ever more challenges to assure the reliability of electronic products. Thermal cycling reliability of leadfree chip resistor solder joints article pdf available in soldering and surface mount technology 162. The objective of this study is to compare the effect of different failure criteria on the reliability life estimation. It was also found that solder joint reliability can be enhanced by making solder joints that have convex. Reliability assessment of preloaded solder joint under.
Kimura the appropriate selection of failure criterion for solder joint studies is necessary to correctly estimate reliability life. Study on solder joint reliability of fine pitch csp yong hill liang, hank mao, yonggang yan, jindong king lee. As the number of joints increase, 2 and their size decreases, the reliability of solder joints becomes an issue because they are. Solder joint failures solder joints refer to the solder connections between a semiconductor package and the application board on which it is mounted. Association connecting electronics industries mechanical. Solder joint reliability is defined as the ability of your products solder joints to function under given conditions and for a specified period of time without exceeding acceptable failure levels.
Pdf the state of pbfree solder a joint reliability overview. Pdf comprehensive boardlevel solder joint reliability. Comprehensive boardlevel solder joint reliability modeling and testing of qfn and powerqfn packages article pdf available in microelectronics reliability 438. A compressive loading is usually applied to reduce the interfacial thermal resistance between package and heat sink. Explores failure mechanisms and includes practical methods for testing, analysis, and life prediction of solder joints subjected to conditions of fatigue, creep, stress relaxation, shock, and vibration. Solder attachment reliability, accelerated testing, and result evaluation. Solder is known to be a highly strain rate dependent. It is intended to be used as a general guideline for mechanical drop and shock testing.
Failure analysis was performed on several samples after atc testing. Solder joint reliability in todays competitive business environment balancing the conflicting demands of miniaturization, performance and efficiency are paramount. Addressing the issues around solder joint voids in surface mount products 1. Solder joint does not have adequate ductility to ensure the repeated relative displacements due to the mismatch between expansion coefficients of. Three different package platforms with different au thicknesses were assembled on boards with two different au thicknesses using a standard surface mount assembly line in a realistic production environment. May 23, 2016 an overview of the solder joint reliability assessment methodology for a custom design leadfree, high performance rf package has been presented, including. Comparison of reliability of solder joints by form and sorm. Field mechanical stress will be monitored and fem modeling will be conducted to. Reliability of solder joints assembled with leadfree solder. In phase iii, the methodology to established the residual stress under mechanical bending to the reliability scale is proposed.
An acceleration model for leadfree sac solder joint. The effects of solder joint geometry on waferlevel chipscale package reliability have been studied both through simulations and board level reliability testing. In phase ii, the correlation of solder joint reliability of. One key interest in this thesis was the use of tinlead. Eutectic ausn solder is increasingly used in high reliability andor high temperature applications where conventional snpb and pbfree solders exhibit insufficient strength, creep. The effect of these factors on the solder joint reliability is discussed. Failure analysis and design of a heavily loaded pin joint by nader farzaneh submitted to the department of mechanical engineering on march 27, 2002, in partial fulfillment of the requirements for the degree of master of science in mechanical engineering abstract. Processing and reliability assessment of solder joint. Solder joint reliability solder joint reliability, or sjr, is the ability of solder joints to remain in conformance to their visualmechanical and electrical specifications over a given period of time, under a specified set of operating conditions. Montclair, nj abstract this paper presents a quantitative analysis of solder joint reliability data for leadfree snagcu sac and mixed assembly. This study is focussed on investigating the effect of voids on the reliability of solder joints.
In demanding ball grid array bga applications, the solder joints are a primary point of failure. S2831 leadfree and mixed assembly solder joint reliability trends jeanpaul clech, ph. The effect of voids on the reliability of solder joint may depend not only on the size, but also on frequency and location. Solder joints are responsible for both electrical and mechanical connections. The size, location and frequency effects on the reliability were studied. In this chapter, we evaluate the reliability of the produced solder joints for power chip interconnection. Looks at how solder joint reliability is influenced by flux reactions, solder paste, reflow methods, wave soldering, and cleaning. Solder joint reliability is the ability of the interconnect to retain functionality under use environments. Reliability analysis of lowag bga solder joints using four failure criteria erin a. Reliability assessment of preloaded solder joint under thermal cycling the ever increasing power density in modern semiconductor devices requires heat dissipation solution such as heat sink to remove heat away from the device. In this paper, the effects of varying boundary conditions on the failure probability of the solder joint are studied by using the probabilistic approach methods such as the first order reliability method form and the second order reliability method sorm. This chapter is organized into various sections beginning with the section that lays emphasis on the need for reliability. Solder joint reliability of bga, csp, flip chip, and fine pitch smt assemblies lau, john h. Improving wlcsp reliability through solder joint geometry.
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